DEBIX is essentially a single board computer, which can be widely used in artificial intelligence, machine study and industry 4.0 applications.
· Powerful Quad Core Arm ® Cortex ® -A53 CPU with a Neural Processing Unit (NPU) operating at up to 2.3 TOPS.
· Dual image signal processors (ISP) and one camera inputs for an effective advanced vision system.
· The multimedia capabilities include video encode (including h.265) and decode, 3D/2D graphic acceleration, and multiple audio and voice functionalities.
· Real-time control with Cortex-M7. Robust control networks supported by dual CAN FD and dual Gigabit Ethernet with Time Sensitive Networking (TSN).
· High industrial reliability with DRAM inline ECC.
· Designed for severe environmental conditions and industrial grade temperature requirements. The wide CPU temperature range of -40°C to 105°C makes it suitable for extreme operation environments like public transportation and industrial control etc.
· The credit card form factor board contains 40 GPIO ports. This allows DEBIX to give full processor performance while being free from application restrictions in physical space.
· Support mainstream operating systems including Android, Ubuntu and Yocto.

(1) Multiple cores and high-speed memory:
4 or 2 x Cortex-A53 cores run at up to 1.8GHz;
Cortex-M7 up to 800MHz;
32bit DDR4 and LPDDR4 up to 4.0GT/s;
(2) Advanced machine learning and vision:
Neural Processing Unit (NPU): up to 2.3 TOPS;
Dual image Signal Processors (ISP): Resolution reaches 12MP and the max. input rate is 375M pixels/s;
Camera Interfaces: 2 x MIPI CSI;
(3) Advanced multimedia and display:
Video decoding: 1080p60, h.265/4, VP9, VP8;
Video coding: 1080p60, h.265/4;
GPU: 16 GFLOPS (high precision) OpenGL ES 3.1/3.0, Vulkan, Open CL 1.2FP, OpenVG 1.1;
Audio: 18 x I2S TDM, DSD512, S/PDIF Tx + Rx, 8-channel PDM Mic In, eARC, ASRC;
Low-power voice accelerator: Cadence Tensilica HiFi 4 DSP @800 MHz;
Display: MIPI-DSI, HDMI 2.0a Tx, LVDS (4/8-lane) Tx;
(4) High-speed interface:
2 x Gigabit Ethernet, supports AVB, IEEE 1588, EEE and 1 x w/TSN;
2 x Dual-purpose USB 3.0/2.0, with Type-C PHY;
3rd Gen. PCIe;
3 x SDIO 3.0;
2 x CAN FD;
(5) Industrial reliability:
DDR inline ECC for LPDDR4 and DDR4;
14 FinFET technology to realize low soft error rate (SER);
(6) Operating system:
Linux, Android, Yocto;
(7) Packaging and temperature:
FCBGA, 15 x 15 0.5 mm interval;
Commercial grade : 0℃ to 95℃ Tj;
Industrial grade: -40℃ to 105℃ Tj;